老虎机抓鬼躲猫猫A plasma cleaning and surface activation solution for SMT and PCB assembly.
老虎机抓鬼躲猫猫The Saturn system delivers superior efficiency and uniformity for applications such as surface cleaning, activation, and micro-roughening, made possible through a high-volume process chamber and state-of-the-art plasma generation and gas feed systems.
老虎机抓鬼躲猫猫• Pre-molding: improve fluidity and adhesion of molding material.
老虎机抓鬼躲猫猫• Pre-conformal coating: increase functional group density at the surface to improve adhesion and reduce delamination.
老虎机抓鬼躲猫猫• Adhesion enhancement: improve surface energy for better adhesion.
老虎机抓鬼躲猫猫• PCB substrate treatment: surface activation of the PCB substrate allows for better lamination.
老虎机抓鬼躲猫猫• Pre-Molding Plasma Cleaning：
老虎机抓鬼躲猫猫Removes residue nano-scale contaminants attached to module surfaces and enhances surface energy to improve fluidity and adhesion strength of the molding material.
老虎机抓鬼躲猫猫• Pre-Conformal Coating Plasma Activation：
老虎机抓鬼躲猫猫Significantly improves density of active functional groups at the surface, allowing stronger bonding between the substrate and coating material, addressing common concerns with yields and coating performance in manufacturing and biomedical industries.
• Adhesion Enhancement：
Plasma treatment could significantly increase wettability, rendering inert materials such as ceramics and polymers possible to adhere to. This facilitates the assembly process and improves reliability.
• PCB Substrate Treatment：
Plasma treatment can be applied to rigid, flex, and rigid-flex hybrid PCBs, removing surface contaminants and increasing surface energy. Successive Subsequent processes could benefit from a cleaner and more active surface.
|Enclosure||WxDxH||1301Wx1477Dx2080H mm- 2485H mm With light tower|
|Chamber||WxDxH||800W x 863D x 800H mm|
|Electrodes||WxDxH||760W x 680D mm; 29.9W x 26.8D inch|
|Max Number of Electrods||12|
|PF System||RF Power&Frequency||5kW/40kHz|
|Gas Control||Number of MFCs||2 standard/ up to 5|
|Vacuum Pump||Pump||500m³/Roots Pump+80m³/h Dry Pump(optional)|
|Dry Pump Purge N2 Flow||5-25L/min|
|Facility Reauirements||Power Supply||380V, 50A, 50Hz, 3-Phase, 5-Wire|
|Process Gas Fitting Size&Type||0.25 in.OD|
|Process Gas Purity|
CF4 = 99.97%; O2 = 99.996%; N2 = 99.99%;
Ar = 99.999%;
|Process Gas Pressure||15~30 psig|
|Purge Gas Fitting Size&Type||0.25 in.OD|
|Purge Gas Purity||N2=99.99%|
|Purge Gas Pressure||15-30 psig|
|Pneumatic Valves Fitting Size&Type||0.25 in.OD|
|Pneumatic Gas Specifications||CDA、60-90psig|
|Exhaust Size & Type||KF40|
|Cooling water flow||16L/min|